Fairchild, Infineon standardize on packaging for power MOSFETs

San Jose, Calif. — Fairchild Semiconductor and Infineon Technologies have announced a packaging partnership for their power MOSFETs in the MLP 3×3 (Power33 or S3O8) and PowerStage 3×3 packages. The compatibility agreement applies to their asymmetric, dual and single MOSFETs for dc/dc applications from 3 A to 20 A.

“Fairchild and Infineon have standardized the pin-out and have complementing performance levels, offering customers two sources for their high-efficiency design needs in the computing, telecom and server markets,” said John Bendel, Fairchild’s senior vice president of Low Voltage Products, in a statement. “This package alignment is staged to deliver performance leading products in a multi-source, industry standard package.”

“Standardizing power packages benefits our customers as we minimize the amount of ‘unique’ packages available in the market place, while offering solutions that enhance performance levels in smaller form factors than the previous generations,” stated Richard Kuncic, director and product line manager Low Voltage MOSFETs at Infineon Technologies.