Neubiberg, Germany — Infineon Technologies and Mitsubishi Electric Corp. have signed a second source agreement for IGBT modules in easy assembly SmartPACK and SmartPIM packages. The agreement allows Mitsubishi to package its power chips in Infineon’s advanced IGBT module packages — the SmartPACKs and SmartPIMs, to ensure a stable supply chain for customers in the industrial motion controls and drives markets.
Under this agreement, Mitsubishi Electric will market its latest generation power chips of various ratings (current range: 15A up to 150A, voltage class: 600V and 1200V) in Infineon’s Smart-1,-2 and -3 housings.
As the creator of the new SmartPACK/PIM module concept, Infineon will continue to manufacture and supply the same range of fully compatible products using its own chip technologies and module manufacturing.