Mountain View, Calif. — Siemens Medical Solutions USA, Inc. and National Semiconductor Corp. (Santa Clara, Calif.) have formed a strategic alliance to develop ultrasound imaging systems that produce enhanced image quality and advanced 3D/4D imaging capabilities, while consuming less power.
The partnership leverages Siemens’ leadership in ultrasound technology with National’s energy-efficient analog semiconductor capabilities, providing power management, signal path and transducer solutions.
Based on the companies’ collaboration, Siemens’ ultrasound systems will be able to provide next-generation imaging quality and new applications, while being more energy efficient. The end goal is to provide medical ultrasound systems that improve workflow efficiency, diagnostic reliability and ease of scanning.
“For many years, we have been pushing the envelope to advance ultrasound imaging to the next level. Large data volumes and the increased demand for portability require systems with an effective balance between power efficiency and performance. We view National Semiconductor as a strategic analog alliance to help us make this happen,” said Dr. Norbert Gaus, chief executive officer, Ultrasound, Siemens Healthcare, in a statement.
“This is an ideal alliance, which effectively leverages both companies’ strengths. Already well known for its world-class healthcare solutions, Siemens’ next-generation ultrasound systems will be enhanced by our high-performance technology, chipsets and subsystem-level solutions,” said Mike Polacek, senior vice president of Key Market Segments and Business Development for National Semiconductor, in a statement. “We are going to do great things together.”