Sunnyvale, Calif. — OSRAM Opto Semiconductors will be increasing its production output by converting its two chip manufacturing facilities to 6-inch wafers while expanding production at both plants.
A new production building is currently under construction in Penang, Malaysia, while in Regensburg, Germany, the existing space is being reallocated. The two facilities will each be converting to the new manufacturing technology, introducing 6-inch wafers to replace the current 4-inch wafers. These measures are expected to almost double OSRAM’s chip production capacity for white LEDs by the end of 2012.
The capacity expansion will primarily impact indium gallium nitride (InGaN) chips using thin-film and UX:3 technology, which are required in the production of white LEDs.
With this move, OSRAM expects to capitalize on the growth potential of international LED markets. The total manufacturing area of the Penang chip manufacturing plant, which opened nearly two years ago, will be increased to around 269,000 sq. ft. in 2012, creating about 400 additional jobs.