Hybrid subrack offers best of both

Schroff has introduced a new hybrid system that combines established bus formats such as VME or CompactPCI with emerging MicroTCA technology in a single 3U-high 19in subrack. This enables users to work with two technologies in parallel, eliminating worries about the cost of migrating to a new platform.

One side of the subrack is equipped with conventional 19in components to accommodate 3U VME or 3U CompactPCI boards, while the other side consists of a MicroTCA board cage that accepts AdvancedMC single modules.
The system is available either with a through-connected monolithic backplane or with two isolated backplanes connected via a front-panel PCIe data interface.