Tyco Electronics has developed a new breed of power interconnect, the Multi-Beam XLE and Minipak HDL connectors, to meet growing demand for increased current density with modular power solutions. The new designs claim to make better use of available airflow and offer improved long-term reliability. Contact design and material selection have also been upgraded to address challenges related to energized mate and un-mate cycles and exposure to corrosion-enhancing environments while maintaining low milli-volt drops.
According to Tyco Electronics product manager, Mike Blanchfield: Current standard solutions fall short of the future needs of the industrial, computer and telecommunication markets. We believe these new power interconnects provide solutions that will endure for years to come.
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