Bergquist claims its Thermal Clad HPL (high-power lighting) dielectric for metal substrates increases freedom to optimise light output, LED count and lifetime. Optimised for high-power LED lighting and similar applications, the technology is said to allow lower operating temperatures, higher LED driving currents and reduced component count.
Thermal conductivity of 3.0W/m-K, results in a thermal resistance of
0.13Ccm2/W. The 38m dielectric suits Bergquists aluminium and copper insulated metal substrates. Thermal Clad HPL is supplied as scored array circuits, scored singulated circuits, or punched singulated parts.
Maximum operating temperature and continuous operating voltage are 150C and 170V DC (120V AC) respectively.