EPCOS presents an improved and particularly rugged version of SMT power inductors for automotive electronics. Their design, which features a baseplate with injection-molded termination clips, increases the mechanical stability and improves the temperature distribution during the solder process. Lands with a nickel barrier-layer coating satisfy the tougher demands for use in automotive electronics. The new series currently comprises six types: four shielded (P series) and two unshielded (M series). Depending on the type, their dimensions range between 7.3 x 7.3 x 4.5 mm3 and 12.5 x 12.5 x 8.5 mm3.
The components are available with inductances from 0.82 to 1000 H, and have a current handling capability of up to 15 A. Their series resistance is only 5.5 m at low inductances. All types are designed for operating temperatures of up to 150 C and pass a vibration test of 10 g for 72 h. They also satisfy the requirements of the handling-drop test to ISO 16750-3.
The new SMT power inductors are qualified to the AEC-Q200 standard and satisfy the solder profile to JEDEC-020-C.