Filling the gap on thermal management

Mouser Electronics has announced a global distribution agreement with developer and manufacturer of thermal management materials, The Bergquist Company.

Under the new agreement, Mouser will distribute Bergquist’s portfolio of thermal management materials, which includes Sil-Pad, thermally conductive insulators and various speciality materials, plus Gap Pad, gap filling materials, phase change materials and Bond-Ply. Bergquist also manufactures Thermal Clad, insulated metal substrate and thermal management substrates for high-power and surface mount applications. Bergquist can also process thermal clad and thermally conductive insulated metal substrate (IMS) circuit boards designed to replace conventional FR4 PCBs in LED applications.

Mouser vice president of electromechanical, power and test, Keith Privett, said: “Bergquist has a long history of innovation that design engineers are looking for. Now, they have an even wider selection of thermal management products, upholding Mouser’s speed-to-market advantage.”