New brochure details enclosure solutions for telecoms

Electronics packaging specialist Schroff has released a new brochure detailing the company’s extensive range of standard products for the telecoms market and outlining its capabilities for producing custom-engineered solutions.

The ‘Telecom Technologies’ brochure is aimed at anyone involved in specifying enclosures or fully integrated systems for use in core, metro, access or enterprise applications.

In its 24 pages, the brochure covers technology such as outdoor and indoor cabinets, subracks, high-speed backplanes, thermal management products and power supplies, as well as preconfigured systems based on the AdvancedTCA, MicroTCA and CompactPCI open standard architectures.

The key features and benefits of each product type are clearly presented, along with examples of customised solutions that Schroff has produced for users in the telecoms sector.

A section is also dedicated to Schroff’s engineering capabilities, which encompass R&D, design, simulation, prototype construction, testing, certification and production.

The brochure can be obtained by visiting, clicking on the ‘Catalogue Request’ button and either ordering a printed version or downloading it in PDF format. It can also be viewed online in page-turning mode.