Integrated Single Chip inverters with optimised IGBT structure save space and deliver 20% reduction in power loss in BLDC Motor Drives

Intelligent Power Devices (IPDs) Require Just Logic Input for Effective and Efficient Motor Control

Toshiba Electronics Europe (TEE) has launched a new series of highly integrated, single-chip inverter IPDs (intelligent power devices) that minimise component count and improve efficiency in inverter drives for brushless DC (BLDC) motors.

Offering a 20% reduction in power loss compared to previous device generations, the TPD4144K and TPD4144AK IPDs (intelligent power devices) provide single-chip solutions to high-voltage PWM control in applications including home appliances, low-power fans and pumps and industrial automation systems. All that a designer needs to deliver effective motor control is provide a logic input from a host microprocessor or motor controller.

Designed for motor control applications requiring output voltages and currents up to 500V and 2A, the TPD4144K and TPD4144AK are supplied in compact DIP26 packaging measuring just 32mm x 13mm. The packages are fully pin-compatible with other Toshiba IPDs. Each package integrates full three-phase inverter bridge operation including input logic, a level-shift high-side driver, a low-side driver, a three-phase bridge output using IGBTs to provide current to the motor stator, and a three-shunt resistor circuit for current sensing.

Component count, board space and cost are further reduced thanks to integrated fast recovery bootstrap diodes, on-board protection – under-voltage protection and thermal shutdown are standard on both devices, while the TPD4144K offers additional over-current protection – and a built-in 7V (typical) regulator. In addition, designers can configure dead-time settings to ensure optimised sinusoidal drive waveforms.

Toshiba’s new IPDs have been fabricated using the company’s proprietary SOI (silicon on insulator) in which the IC is constructed on an insulator. This allows the high voltage output element and the logic/drive circuits to be realized in a single device. Trench isolation ensures minimum isolation area, while optimised IGBT technology has helped to reduce power dissipation.