First sponsors announced for embedded platforms conference

Farnell, Infineon, Toshiba, TQ Systems and Texas Instruments are the first companies to sponsor the new embedded platforms conference, which is being held in conjunction with electronica for the first time on November 14 and 15. The International Trade Fair for Electronic Components, Systems and Applications takes place in Munich from November 13 – 16.

Efficient and future-proof embedded platforms coupled with the appropriate operating system are essential to the success of products such as embedded applications. Nicole Schmitt, Exhibition Group Director for electronica: “Thanks to leading suppliers from the sectors for electronic components as well as semiconductor and system solutions, the program of events at the embedded platforms conference promises to be a complete success.” Apart from selecting the right embedded modules, the two-day conference revolves around fundamental topics such as the choice of components and system design. In 45-minute presentations, representatives of the sponsors will give participants an overview of existing platforms and solution approaches that they use to support developers when it comes to component selection and system design. A series of half-day lectures and practical labs that examine the fundamentals of and selection criteria for embedded platforms are also planned.

The embedded platforms conference is being held at the Press Center East on the grounds of Messe München on November 14 and 15, 2012.