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Energy-efficient mobility will be a central theme for the show

Smart energy, e-mobility and automotive innovation will be some of the hot topics driving discussion at this year’s Electronica forum and conference program

From components and systems to electronic applications and services, Electronica is once again the place to be this autumn for anyone involved in specifying or designing electronics. During the show, which takes place in Munich for the 25th time this year, 13 to 16 November, more than 2,500 international exhibitors will present their product and service portfolios to visitors from around the world.

Central themes for this trade fair revolve around smart energy solutions, e-mobility, embedded solutions and power electronics in general. These topics will be reflected both in the exhibition and in the program of conferences and related events.

Tracking trends

Four forums will take place during Electronica: the automotive forum, embedded forum, Electronica forum and PCB marketplace. The range of topics is diverse and gives visitors a chance to gather information about current and future issues that pertain to various application sectors in more than 130 practice-oriented presentations that go beyond the exhibition.

While the Electronica forum features lectures on topics such as medical electronics and trends in microsystem technology, speakers at the automotive forum will deal with topics such as efficient dynamics in mobility and innovative light concepts for the automotive sector. The embedded forum will examine topics such as smart metering, micros and DSPs and embedded computing. Finally, the PCB marketplace will focus on market trends for PCBs, film-type integrated circuits and electronic assemblies and the component industry’s target markets.

 Get stuck in

The first-ever embedded platforms conference will be held on 14 and 15 November. Companies such as Atmel, Farnell, Freescale, Infineon, Texas Instruments, Toshiba and TQ Systems will give participants an overview of the ecosystems involved in modern embedded platforms.

The CEO round table will focus on semiconductor solutions for smart grids of the future.

To develop successful electronic products, selecting the right embedded modular system is not the only issue. Another essential aspect is ensuring efficient interaction between the processor platform, the operating system, the drivers and the networking technology and matching it to the specific application in question. This forum is targeted at helping those faced with this challenge, providing them with an opportunity to gather information about selecting the right solutions for their needs.

Driving development

Driving safety, energy-efficient mobility, in-vehicle internet access and design-to-cost are the topics at this year’s automotive conference, which traditionally begins one day before the fair.

Strategy lectures on electrification of the powertrain and in-vehicle cloud computing are on the agenda on 12 November. Then on the following day, the conference will focus on the latest developments for technical experts in the automotive industry, as well as for OEMs, component manufacturers and software developers who deal extensively with components. One lecture, for example, will examine the question: standardisation – which standard is the right one? For the first time ever, a panel discussion on mobility concepts is also planned.

More than 2,500 international exhibitors will present their product service portfolios.

Where’s wireless headed?

The wireless congress takes place 14 and 15 November. Industry specialists will not only examine technical aspects of current and future wireless technologies, especially for use in industrial applications, but will also give participants insights into applications, security aspects, standards and market opportunities. This year’s topics include wireless technologies in vehicles, new Bluetooth applications, power supplies and energy harvesting. Keynotes from IHS iSuppli, Bluetooth SIG and ZigBee Alliance are also on the agenda.

Forging ahead

Electronica will again host its CEO round table event, this year focussing on semiconductor solutions for smart grids of the future. To successfully implement the necessary transition to renewable energy sources, distribution grids must not only be expanded, but better controlled and monitored. This will be the central theme of discussion for a panel of high-calibre speakers, who will come together on the first day of the fair, 13 November.

Moving from those at the pinnacle of their career to those at the beginning, Electronica  also aims to provide a platform for future electronics industry professionals, which is essential for the successful continuation of the industry. Together with SEMICA, the VDE and the ZVEI, Electronica is organising student day on the last day of the fair for some 300 prospective engineers. Participants can get tips for starting their careers and enjoy a networking lunch with sponsors.

www.electronica.de