AOI designer and manufacturer Mek (Marantz Electronics Ltd) will showcase a line-up of AOI systems at this year’s SMT Hybrid Packaging, including the new SpectorBOX “Bottom-Up” Modular AOI system specially engineered for wave and selective solder THT and SMT manufacturing.
The Mek team will be on hand with distributor SmartRep GmbH at Booth 7-419 to deliver live demonstrations of the SpectorBOX which is designed to accommodate solder frames on return and/or feed conveyors. SpectorBOX offers bottom side, top side or simultaneous dual side inspection replacing traditional board flipping alternatives in less space and at lower cost. With its totally new mechanical platform, it is the only modular AOI in the market that can be equipped with 9 cameras, including an optional Z-axis moveable head to precisely position and focus for varying PCB distance and warpage. With its general purpose I/O, SpectorBOX can be simply interfaced with existing or new conveyor systems.
Also on display will be the PowerSpector AOI with FDAz inspection head, which introduces a new era in capture quality. The FDAz inspection head enables 9 Camera AOI featuring Tilt- Shift & Telecentric optics withautomatic Z-axis. 8 Side cameras in 10µ resolution with Tilt-Shift optics technology … familiar in architectural photography… reduce image distortion to enable the best capture possible. A moveable head in Z-Axis brings objects into optimal focus and position, independent of PCB thickness or warping. In combination with the HD 18.75µ or 10µ resolution top camera with Telecentric optics and unique multiplexed 8x CameraLink side camera technology, unprecedented defect visibility is achieved.
Find out more at www.mek-europe.com