Ventec has expanded its tec speed 20.0 range of hydrocarbon-based PCB materials with the new VTM1000i, designed to offer impressive thermal reliability and exceptionally high Dk (9.8) and low Df (0.0023) typically seen only in PTFE materials. Applications include high-end RF environments including satellite communications and 5G RF use.
Designed for antenna, communication, radar and aviation systems, VTM1000i is available in a range of dielectric thickness (0.38 to 3.81mm) and offers high decomposition temperature (Td) of 426°C.
Ventec’s CEO, Jason Chung, said: “Tec-speed 20.0 VTM1000i represents a top-tier option for use with satellite communications systems, GPS antennas and other RF and microwave circuitry. We will be showcasing this new laminate worldwide at events throughout 2023.”
