Mouser Electronics is stocking Molex’ Quad-Row board-to-board connectors which feature a staggered circuit layout and a 0.175mm pitch low-profile design for 30 per cent space savings over conventional connectors. These patent-pending connectors offer manufacturers freedom and flexibility to support compact form factors, ideal for augmented reality/virtual reality, automotive, communications, IoT, medical and wearable applications.
The connectors offer a 3.0A current rating and aligns with a 0.35mm soldering pitch for volume manufacturing using surface mount technology processes. Reliable, robust performance is assured thanks to interior armour and insert-moulded power nail, which safeguards pins from damage during volume manufacturing and assembly. These capabilities, along with a wide alignment, facilitate easy, secure mating and low fallout rates.
Molex’ VP and general manager, Micro Solutions Business Unit, Justin Kerr, said: “With the high-density, Quad-Row board-to-board connectors, our customers now can squeeze more features, sensors and functionality into increasingly tight spaces without compromising device performance.”