Micross offers a single-source solution for the design and manufacture of specialty microelectronic components.
With authorised access to die and wafer suppliers, plus advanced packaging, assembly, modification and test capabilities, Micross can provide solutions including bare die, fully packaged devices and complete program lifecycle sustainment. Applications include aerospace, defense, space, medical and industrial.
Regarding bare die, Micross has access to over 70,000 part types and offers the knowledge capabilities and flexibility to adapt suppliers’ standard products to the unique requirements of customers’ devices or systems. From simple diodes to advanced analog ICs and digital components, Micross can support initial design and manufacture, to post-production end-of-life (EOL) lifecycle sustainment.
As a QML supplier certified to AS9100, ISO9001 and ISO14001 operating to MIL-STD-750, Micross operates in aerospace, defense, space, industrial-embedded and medical diagnostic markets. The company is certified to MIL-PRF-38535 Class Q & V, MIL-PRF-38534 Class H and has over 1,100 part numbers listed with DSCC, on various SMDs.
Micross offers a range of capabilities from design to test. For example, its DMEA Trusted Source facilities provide advanced packaging and electrical/environmental testing, while its counterfeit mitigation facility ensures authenticity to specification.
When military or space grade products are unavailable, Micross offers an array of solutions to provide these hard-to-get components.
An obsolete, long-lead time or high-priced device mounted on an otherwise defective or obsolete circuit assembly can be removed, refinished and verified for re-use by the original source, saving the costs of redesign or replacement. Micross salvages expensive and rare components, specialising in BGAs (removal and/or reballing) and provides these as either discrete components or installed on new boards.
The company also offers a range of component/lead preparation services and can modify tooling to meet custom packaging requirements.
Micross offers robotic hot solder dip (RHSD) technology, the only process approved by the TMTI report to eliminate tin whisker risk without damaging the component. Micross states no one comes close to RHSD’s precise controls, enabling it to service components most efficiently, accurately and consistently.
Micross supports application specific requirements where either leaded or non-leaded components are required and can convert to any device footprint with processes that are NADCAP certified and compliant to the IEC TS62647-4 international standard. The process has undergone extensive qualification at independent labs, validating the process as safe and reliable.