CUI Devices’ Thermal Management Group has expanded its BGA heat sink line. Compatible with ball grid array (BGA) devices, the HSB family now offers aluminum/copper material options, clean/black anodized material finishes and adhesive/ PCB mounting styles. All BGA heat sink models are measured under four conditions for thermal resistance, making it easier for designers to select the optimal heat sink for their natural convection or forced air cooled system.
Supporting a range of sizes from 8.5 by 8.5mm to 69.7 by 69.7mm, with profiles from 5 to 25mm, the heat sinks feature thermal resistances from 3.45 to 39.1°C/W at 75°C ΔT in natural convection and power dissipation ratings from 1.92 up to 21.74W at 75°C ΔT in natural convection.
The HSB models are available immediately with prices starting at $0.51 per unit at 500 pieces through distribution.