Mouser Electronics is stocking Infineon Technologies’ HybridPACK Drive G2 modules, designed to deliver high power density in a compact size. The modules offer an efficient power solution for traction inverters in electric vehicles and hybrid electric vehicles.
The modules incorporate Infineon’s next-generation EDT3 (Si IGBT) and CoolSiC G2 MOSFET chip technologies for scalable performance. They boast a range of features that enable system cost improvements, including sensor integration options and on-chip temperature sensing. The modules also offer package enhancements for better performance and product life. Improved pin rivets ensure robustness over the entire temperature range, while a PinFin baseplate allows for direct cooling.
Power range is up to 300 kW within the 750 and 1200 V classes. The modules offer improved thermal conductivity and high durability, ideal for harsh environments. The SiC provides superior gate oxide and cosmic ray reliability and reduces inverter losses by two-thirds compared to state-of-the-art IGBT solutions.