In this article, IPC’s senior director of North American relations, Richard Cappetto, highlights new funding streams for advanced packaging materials and substrates.
IPC praised issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.
IPC’s senior director of North American relations, Richard Cappetto, said: “IPC applauds this very important milestone in the work to build a more resilient semiconductor manufacturing supply chain in North America. Today’s action is a welcome milestone following years of education and advocacy work by IPC and our partners. It will help ensure that the United States can bridge current gaps in its semiconductor supply chain and position itself to be a leader in the global marketplace with the ability to manufacture cutting-edge technologies.”
Advanced packaging is driving semiconductor innovation by introducing greater electronic interconnection within semiconductor packages. Electronic interconnection is key to US semiconductor leadership, and industry leaders call advanced packaging the ‘new king’ of innovation in the chips sector.
The NOFO makes $300 million available for multiple awards of up to $100 million each for up to five years. Investments will be focused on projects that achieve ambitious targets for one or more of the program’s chief objectives:
• Accelerate domestic R&D and innovation in advanced packaging materials and substrates
• Translate domestic materials and substrate innovation into US manufacturing
• Support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing
• Promote a skilled and diverse pipeline of workers for a sustainable domestic advanced packaging industry