Sullins Connector Solutions’ High-Density Card Edge Connectors Optimized for 0.031″, 0.062″ and 0.093″ Thick Boards

SUL.HD.6.10.14Sullins Connector Solutions, Inc., a world leader in the design and manufacturing of RoHS-compliant board-level interconnects announced the expansion of their portfolio of high-density 0.050″ (1.27 mm) contact center card edge connectors to include the FMBx Series. The new series features high-temperature and low profile ultra-thin devices accommodating boards in thicknesses of 0.031″ (0.80 mm), 0.062″ (1.60 mm) and 0.093″ (2.40 mm). The series supports an operating temperature range of from -65° C to +200° C, while the low profile ultra-thin interconnects notably boast a profile of only 0.488″. Also available are 0.039″ (1.0 mm) versions, which support operating temperature ranges of from -65° C to +200° C. Engineered to provide OEMs/ODMs with the utmost in design flexibility and manufacturing efficiencies, connectors are offered in an array of terminations including staggered dip solder, right angle, card extender, through-hole (PTH) and surface mount (SMT). Mounting style choices consist of flush mounting, flush mounting with threaded inserts, no mounting ears, and metal board-lock. The new card edge connectors are available with varied head and tail length options to facilitate countless custom and standard applications. Materials are UL94V-0 rated and withstand reflow processes up to 260° C peak for 20 seconds max.

The single-level and bi-level (double depth) card edge connectors are ideal for employment in a wide range of high-temperature, high-density medical, industrial process control and telecommunications designs in which the board is thinner or thicker than standard boards, as well as those in which a standard 0.062″ board is indicated. The parts accommodating 0.031″ thick boards are particularly well suited for medical applications, while those engineered for 0.093″ boards are commonly used in multi-layered, thicker board designs. The entire interconnect series is broadly used in medical equipment, computers and peripherals, telecommunications, industrial, burn-in ovens and test equipment, aerospace and military, consumer electronics and appliances, automotive and gaming applications.

Single-level card edge connectors feature a current rating of 1 A per contact; bi-level (double depth) versions support a contact rating of 3 A per contact pair, maximizing power per inch (PPI). All versions are offered with from 5 to 120 contact pairs, and with a choice of materials and plating options, including selective and fully-plated gold. The devices optimized for 200° C high-temperature applications are provided with cantilever pins. Depending on specified materials and mating board, the robust parts can withstand 500 to 5000 mating cycles minimum. Molded key slots, card guides, and other customizations are also offered.