Parker Hannifin’s Chomerics Division has released Therm-a-Gap PAD 70TP, an ultra-soft (15 Shore) high-performance thermally conductive gap filler pad for demanding industrial applications.
The product offers 7.0W/m-K thermal conductivity, ultra-soft conformability and low outgassing, providing an effective thermal interface between heat sinks and electronic devices, even where uneven surfaces, air gaps or rough surface textures exist.
Said to provide superior thermal performance and long-term stability in comparison with conventional thermal pads, uses for the product extend from telecommunications equipment and PC boards to chassis applications, thermally enhanced BGAs, memory modules, GPU/CPU applications and a host of industrial devices.
Thermal properties include 0.27°C-in/w thermal impedance (at 10psi, 1mm thickness) and 0.72J/g-K heat capacity.
Other stated benefits include 1013ohm-cm volume resistivity, low deflection force and low oil bleeding. The latter minimises generation of greasy substances on heat sink or substrate surfaces. Oil bleed can lead to lower electrical performance due to reduced surface resistance and breakdown voltage. Also, surrounding impurities and particles may adsorb in or adhere to the oil, threatening product performance and lifespan.
Parker Chomerics manufactures the pads to size, facilitating easy application. A fabric carrier version is available for improved tear resistance and easy handling. Operating temperature range is -55 to 200°C and the pads are available in standard thicknesses from 0.76 to 5.0mm.