Electronics Sourcing Electronica 2024 Special
Factronix will be using its Electronica 2024 stand to introduce visitors to replacement of BGA spheres for quantum computers and to component recovery/re-use.
“Drop-in Replacement” for BGA in High-Speed Computing
Together with TopLine, Factronix recently announced availability of braided solder columns as super- conducting drop-in replacements for
BGA balls for quantum computers and applications at super-cold cryogenic temperatures, such as lunar landings, deep space exploration, scientific sensors/ instruments and AI/ML data centres.
Many discarded electronic devices contain valuable components with significant useful life. The recovery process lets these components re- enter the market, recapturing their economic value. This benefits the companies involved and contributes to a more efficient use of resources. Solder braided columns provide improved reliability and thermal properties over competing technologies, such as solder balls and heritage copper wrapped solder columns which simply aren’t equal to the task.
Component Recovery and Re-use
Electronic waste poses a significant environmental threat. Companies like Factronix, with its Scottish partner Retronix, are making remarkable strides in component recovery and re-use services. This innovative service is helping mitigate e-waste and also recovering lost economic value, safeguarding supply chains and promoting a more sustainable approach to electronic component usage.
TopLine manufactures a range of solder columns for CCGA semiconductor packages, and provides daisy chain CCGA packages for engineering development, profiling and practice, bonding wire, IC chip tray, zero-ohm jumper and more. High precision laser re-balling, economical reflow re-balling, solder refreshing, alloy conversion and component test are the key technologies helping electronic manufacturers successfully complement their ‘go green’ goals.