DigiKey Announces Global Distribution Partnership with MediaTek
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, announced today it has expanded its product portfolio through a global distribution partnership with MediaTek, the world’s fifth largest fabless semiconductor company. MediaTek is a leader in developing tightly…
RTI announces DDS adoption into all AUTOSAR packages and platforms
RTI is the leading DDS contributor in AUTOSAR, committed to enhancing safety and connectivity for automotive systems. Real-Time Innovations (RTI), the infrastructure software company for smart-world systems, announces that the Data Distribution Service (DDS™) standard is now included in the AUTOSAR Foundation Package – a set of shared standards supporting…
Murata Expands IoT Wi-Fi 6 Communication Module Range with Ultra-Compact and Cost-effective Tri-Radio Products
Murata Manufacturing Co., Ltd is expanding its innovative wireless communication module lineup by introducing the new Type 2FR/2FP and Type 2KL/2LL modules. Designed to support the next generation of wireless connectivity across smart home, smart building, and industrial IoT applications, these compact devices feature tri-radio communication including dual-band Wi-Fi, Bluetooth…
OKW’s TOPTEC Universal Enclosures: Perfect for PCBs with Protruding Connectors
OKW reports strong interest in its TOPTEC universal plastic enclosures following the electronica 2024 trade fair in Munich. TOPTEC allows PCBs with protruding connectors and interfaces to be mounted directly into the case. Applications include monitoring, signalling equipment, control systems, medical/wellness devices, computer peripherals, IoT and IIoT. These versatile ABS…
ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry
ROHM Co., Ltd. (ROHM) announced today that ROHM and TSMC have entered a strategic partnership on development and volume production of gallium nitride (GaN) power devices for electric vehicle applications. The partnership will integrate ROHM’s device development technology with TSMC’s industry-leading GaN-on-silicon process technology to meet the growing demand for…
Vishay Intertechnology 1 Form A Solid-State Relay Offers 600 V Load Voltage and Isolation Voltage of 3750 VRMS in SOP-4 Package
Space-Saving, Industrial-Grade Device Combines Fast Turn-on Time of 0.3 ms Typical With Low Leakage Current of 2 nA. Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a 1 Form A solid-state relay offering a 600 V load voltage and isolation voltage of 3750 VRMS in the low profile SOP-4 package. Designed…