Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions, today announced that their award winning MachXO3™ family of devices supports 900 Mbps per lane operation for MIPI D-PHY interfaces, enabled by the latest Lattice Diamond 3.6 design tool suite software update. MachXO3 devices can now be used to bridge a wide variety of image sensors & displays with MIPI D-PHY, CSI-2 or DSI interfaces at speeds of up to 900 Mbps.
Lattice Diamond design software is a complete suite of FPGA design tools with an easy-to-use interface, efficient design flow, superior design exploration and more. The new software release, version 3.6, will enable MachXO3 customers to design more powerful yet still low power, small form factor FGPA bridging and I/O expansion solutions.
“Our MachXO3 FPGAs are becoming popular choices for image sensor and LCD bridging solutions in cameras, displays and machine vision applications,” said Shyam Chandra, senior product marketing manager at Lattice Semiconductor. “In addition, the production-proven MachXO3 family delivers the industry’s lowest power, smallest package sizes, and lowest cost per I/O, making these devices best suited in server, communication, and industrial applications.”
MachXO3L and MachXO3LF devices can now be used for bridging HD (1920×1080@60fps) and WQHD (2560×1440@60fps) displays as well as 4K@60fps with a wide variety of image sensors and processors. The MachXO3 family is available in Wafer Level Chip-scale packages (0.4mm ball pitch) and Flip-chip-BGA (csfBGA package 0.5mm Ball pitch) that are ideal for high performance, small form-factor applications.