Heat dissipation delivers computing performance

DHCS_3D_P (1)(2)-1Advantech’s new thermal solution is designed to accelerate performance of the COM Express CPU module

The dynamic heat conduction system (DHCS) is Advantech’s new thermal solution for the COM Express basic module, designed specifically to pull heat away from the CPU quickly and help it achieve optimum computing performance. It uses a built-in dynamic block to resolve the dimension tolerance between the central processing unit (CPU) and thermal module, so the block can contact the CPU surface tightly without any gap pad. This shortens the heat conduction path and makes heat dissipation more efficient.

In a direct comparison with a traditional two-piece thermal module, Advantech said the DHCS thermal solution was able to deliver a CPU temperature 20°C lower. This can benefit applications that require high computing performance and is especially suitable for high-end COM Express solutions and harsh application conditions, such as those in the traffic, medical and military sectors.

Eliminate board warp

DHCS differs from the traditional thermal module, which usually uses a gap pad as thermal interface material to fill any mechanical gap. Instead it uses a self-adjusting copper block, which contacts the CPU without any intervening material. Moderate pressure is said to be sufficient to keep the dynamic block in tight contact with the CPU surface for heat transfer. Furthermore, this reduction in pressure on the CPU die takes a load off the underlying PCB, which means the board stays flat.

Finally, Advantech cites assembly benefits for the DHCS; it uses standard screws, so users need only follow the torque specification of the screw type to fix the thermal module to the carrier board. This helps make assembly easy and screw heads can be firmly locked to the thermal module to avoid loosening if the system is to be operated in a vibrating environment.