Cypress’ S71KL512SC0 HyperFlash and HyperRAM Multi-Chip Package Now at Mouser

Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the S71KL512SC0 HyperFlash™ and HyperRAM™ Multi-Chip Package (MCP) from Cypress Semiconductor.

This memory subsystem solution combines high-speed NOR flash memory for fast-boot and instant-on with a self-refresh DRAM for expanded scratchpad memory — all in a reduced footprint, low-pin-count package that is ideal for space-constrained and cost-optimized embedded designs.

The Cypress Semiconductor S71KL512SC0 HyperFlash and HyperRAM MCP, available from Mouser Electronics, is based on Cypress’ HyperBus™ interface, which enables faster systems with quicker response times and a richer user experience. The device features 512 Mbits of HyperFlash and 64 Mbits of HyperRAM, and is the optimum multi-package solution for designers looking to get a full high-performance memory subsystem with 70 percent fewer pins and a 77 percent smaller footprint compared to existing SDRAM and Quad SPI solutions.

The S71KL512SC0 device is housed in a 24-ball, FBGA package that shares a common footprint with discrete HyperFlash and HyperRAM products. The single-pad layout and common footprint enables engineers to support either a discrete device or the HyperFlash and HyperRAM MCP, offering the flexibility to change the design at any point in the product lifecycle without affecting the overall board layout, which saves valuable development time and minimizes cost.

Target applications of the S71KL512SC0 device include communications equipment, industrial applications, and other high-performance Internet of Things (IoT) products.

To learn more about the S71KL512SC0 HyperFlash and HyperRAM MCP and the HyperBus Interface, visit