Unpacking the Qualcomm Press Conference at CES 2022

CES, or the Consumer Electronics Show, is arguably one of today’s most awaited tech events. Every year, tech companies show off their best concepts, prototypes, and next-generation products to the rest of the world. CES 2022 was no different despite the threat of the wide-spreading Omicron variant; many exhibitors pulled out at the last minute, leaving many live exhibits bare, with nothing else but a Q.R. code on the floor. Nonetheless, the show did go on and still showed the world unique new concepts, announced exciting developments, and unveiled the next generation products and solutions coming soon. Kicking off day 1 of a week-long expo was Qualcomm, giving the world a glimpse of what is yet to come.

During his keynote presentation, let’s unpack what Qualcomm’s CEO, Cristiano Amon, had in store for the world.

Figure 1: Qualcomm CEO, Cristiano Amon presenting at CES 2022. Source:

Connected Intelligent Edge

Amon opens his presentation by talking about how Qualcomm has its foundations firmly rooted inmobile, defining the pace of technology in the industry. With this comes a budding opportunity,called the Connected Intelligent Edge, where billions of smart devices connected to the cloud, aresignificantly impacting industries and driving a lot of growth potential for Qualcomm.

Amon continues to project that by 2025, 64% of all data will be created outside the traditional data centers driving cloud growth further. In fact, Amon claims that the cloud growth will require the Connected Intelligent Edge with data showing a 35% year-on-year growth based on cloudinfrastructure spend as of April 2021. This trend isn’t just about connectivity for these devices but also the efficiency and smart processing at the edge. In Amon’s words, Qualcomm is the company that will power the edge.

One Technology Roadmap

The way forward for Qualcomm to power the Connected Intelligent Edge is by leveraging this one technology roadmap. Amon quips that mobile presents several challenges such as small form factor requirements, good battery life, well-managed thermals, and overall improved capabilities of sensors, processing speeds, and connectivity.