Nexperia has launched a portfolio of application specific MOSFETs (ASFETs) for automobile airbag applications, headlining with the BUK9M20-60EL single N-channel 60V, 13mOhm logic level MOSFET in LFPAK33 packaging.
The device uses Nexperia’s new enhanced safe operating area (SOA) technology which has been tailored to provide exceptional transient linear mode performance, a key performance metric in airbag applications. It achieves this performance in new LFPAK33 packaging which uses 84 per cent less board space compared to older DPAK packaging, while still maintaining robustness.
Nexperia senior product marketing manager, Norman Stapelberg, said: “Other similar products use older DPAK packaging and are typically based on DMOS and first-generation trench technologies which are being gradually retired by many silicon manufacturers.
“This portfolio of ASFETs uses a combination of the latest silicon trench technology and LFPAK packaging, allowing it to meet the most recent reliability standards. Using the latest manufacturing and packaging technologies makes the supply chain more sustainable and empowers Nexperia to increase capacity to meet the demands of a growing market for these products.”