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Cadence Tensilica HiFi Audio Tunneling for Android Cuts Audio Processing Power by Up to 14X

Cadence Design Systems, Inc. has announced the availability of Cadence Tensilica HiFi Audio Tunneling for Android. As the industry’s first Android-compatible technology for a licensed digital signal processor (DSP), Tensilica HiFi Audio Tunneling for Android takes full advantage of enhancements in the recent KitKat release to prolong battery life in smartphones and mobile devices. The … Read more

Integrated High Voltage Regulator from Diodes Incorporated Boosts Power Density

Diodes Incorporated has introduced a pair of high voltage linear regulators suiting 48V DC power systems in telecom, networking and Power-over-Ethernet equipment. Integrating several components into TO252-4 and PowerDI5060-8 packages, the ZXTR1005K4 and ZXTR1005PD8 help minimize circuit footprint while providing a fixed 5V (+/-2%) output and a high drive capability of 50mA. For high voltage … Read more

Compact DIN rail mounting enclosure saves space on the Rail

Hitaltech are pleased to announce the Railbox Compact, the latest addition to the DIN rail mounting Railbox range of electronic enclosures. Manufactured by Italtronic Srl, the Railbox Compact is a unique and stylish enclosure suitable for electronic applications mounted on a DIN Rail (EN 60715). The enclosure is mounted vertically therefore saving space on the … Read more

Nordic Semiconductor BLE Wireless Chips Expand Digi-Key’s IoT Solution Lineup

Digi-Key Corporation has announced a global distribution agreement with Nordic Semiconductor, a leading provider of ARM-based Bluetooth Low Energy solutions. Nordic Semiconductor is a fabless semiconductor company specializing in ultra-low power (ULP) short-range wireless communication in the license-free 2.4 GHz and sub-1-GHz Industrial, Scientific, and Medical (ISM) bands. Nordic’s ULP wireless solutions enable customers to … Read more

Lime Microsystems launches CMOS multi-standard / frequency single chip MIMO transceiver

Lime Microsystems the inventor of the field programmable RF (FPRF) concept announces its second-generation device, the LMS7002M. The new device, which has already been taped out and will be demonstrated at Mobile World Congress, uses 65nm CMOS technology to significantly reduce the cost of FPRF transceiver technology and significantly reduces the power consumption too. The … Read more

Ellsworth Adhesives Europe offering 3M’s new range of VHB Tapes

3M, the world’s leading adhesives manufacturer, has just announced the expansion of its VHB Tape RPXX series. The new product range will include five different callipers with both paper and filmic liner variants and is available for purchase from Ellsworth Adhesives Europe. The filmic liner is available on RP16F, RP25F, RP32F, RP45F and RP62F in … Read more