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KOE’s TFT display trio exhibit wide viewing angles

KOE Europe, have announced the introduction of three new TFT display modules featuring KOE’s UWVA (ultra-wide viewing angle) technology. The 7.0-inch TX18D45VM5BAA, 8.0-inch TX20D200VM5BAB and 10.4-inch TX26D200VM5BAA feature viewing angles of 80 degrees in all directions (up/down, left/right) and high brightness LED backlights. The 7.0-inch and 8.0-inch displays feature WVGA (800 x 480 pixels) resolution … Read more

RUTRONIK EMBEDDED: New 24nm 8Gb BENAND™ SLC NAND Flash Memory from Toshiba

Toshiba presents the new 8Gb 24nm BENAND™ SLC (single level cell) NAND flash memory with embedded 8bit error correction (ECC). It enables manufacturers to utilize the latest 24nm technology in devices designed to use 4xnm NAND, extending the product life of consumer electronics, multimedia devices, smart meters, intelligent lighting systems and industrial technology. The new … Read more

Mentor Graphics and Digi-Key Bring Professional EDA Software to the Engineering Masses

Global electronic components distributor Digi-Key Corporation, the industry leader in electronic component selection, availability and delivery, has collaborated with Mentor Graphics Corporation (NASDAQ:MENT), the worldwide Printed Circuit Board (PCB) design solutions leader, to create a unique concept-to-prototype design tool targeted for green-field projects before transition to production. Available from Digi-Key, the Designer SchematicTM product from … Read more

Molex Acquires the Heavy-duty Connector Business of Italy-Based Manufacturer Westec s.r.l.

Molex European Holdings BV, a subsidiary of Molex Incorporated, today announced that it has recently acquired the heavy-duty connector business of Westec s.r.l., an industrial connector manufacturer based in Milan, Italy. Westec’s business consists of the manufacturing of more than 6,000 products, including a wide range of junction boxes, multi-pole connectors, and connector assemblies designed for … Read more

TE CONNECTIVITY EXTENDS INDUSTRIAL MINI I/O CONNECTOR PORTFOLIO WITH FIELD INSTALLABLE VERSION

TE Connectivity (TE), a world leader in connectivity, today announced the extension of the Industrial Mini I/O connector portfolio with a Field Installable version. The Mini I/O Field Installable version provides innovative and time-saving wire-termination alongside serving as a space saving and reliable I/O solution for industrial environments. TE’s Industrial Mini I/O solution is only … Read more

Microsemi Continues Its Leadership in Silicon Carbide Solutions by Launching Innovative New Family of SiC MOSFETs for High-voltage Industrial Applications

Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today introduced its new silicon carbide (SiC) MOSFET product family with new 1200 volt (V) solutions. The innovative new SiC MOSFETs are designed for high-power industrial applications where efficiency is critical. These applications include solutions for solar inverters, electric vehicles, … Read more

Ericsson Power Modules new hybrid regulated ratio quarter-brick delivers up to 600W in powering advanced telecoms applications

Ericsson has introduced the third version of its high-power-density quarter-brick power module based on the company’s innovative Hybrid Regulated Ratio (HRR) topology. The PKM4613NH is designed to power applications that require stable voltage and offers available power up to 600W across a wide input voltage range of 36V to 75V and an operating temperature range … Read more